WEDPN8M64V-133BC
Synchronous DRAM Module, 8MX64, 5.5ns, CMOS, PBGA219Manufacturer: Microsemi Corporation
Categories: DRAMs
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The Microsemi Corporation WEDPN8M64V-133BC is a 512Mb Synchronous DRAM module with an 8Mx64 organization. This CMOS component features a maximum access time of 5.5ns and operates with a four-bank page burst access mode. Key functionalities include auto and self-refresh capabilities, enabling efficient data retention. The module utilizes a PBGA219 package, a square plastic/epoxy ball grid array with 219 terminals. Operating within a temperature range of 0°C to 70°C, it supports a supply voltage from 3.0V to 3.6V, with a nominal 3.3V. This component is suitable for applications in networking, telecommunications, and industrial automation where high-speed memory is critical.
Additional Information
Series: WEDPN8M64RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| Access_Mode | FOUR BANK PAGE BURST |
| Access_Time_Max | 5.5000000000000000 |
| Additional_Feature | AUTO/SELF REFRESH |
| Alternate_Memory_Width | 32 |
| JESD_30_Code | S-PBGA-B219 |
| Memory_Density | 536870912.0000000000000000 |
| Memory_IC_Type | SYNCHRONOUS DRAM MODULE |
| Memory_Organization | 8MX64 |
| Memory_Width | 64 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 219 |
| Number_of_Words | 8388608.0000000000000000 |
| Number_of_Words_Code | 8M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 3.60000 |
| Supply_Voltage_Min | 3.00000 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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