WEDPN16M72V-133B2M
Synchronous DRAM, 16MX72, 5.5ns, CMOS, PBGA219Manufacturer: Microsemi Corporation
Categories: DRAMs
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Microsemi Corporation WEDPN16M72V-133B2M is a synchronous DRAM component with a 16M x 72 memory organization. This device offers a maximum access time of 5.5 ns and operates with CMOS technology. It features a multi-bank page burst access mode and includes auto refresh functionality. The component is housed in a PBGA219 package, specified by JESD-30 code R-PBGA-B219, with a terminal pitch of 1.27 mm. Operating across an extended temperature range of -55°C to 125°C, it requires a supply voltage between 3.00V and 3.60V, with a nominal value of 3.3V. This surface-mount device is suitable for applications in demanding environments such as aerospace, defense, and industrial automation where high reliability and performance are critical.
Additional Information
Series: WEDPN16M72RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| Access_Mode | MULTI BANK PAGE BURST |
| Access_Time_Max | 5.5000000000000000 |
| Additional_Feature | AUTO REFRESH |
| JESD_30_Code | R-PBGA-B219 |
| Memory_Density | 1207959552.0000000000000000 |
| Memory_IC_Type | SYNCHRONOUS DRAM |
| Memory_Organization | 16MX72 |
| Memory_Width | 72 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 219 |
| Number_of_Words | 16777216.0000000000000000 |
| Number_of_Words_Code | 16m |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Supply_Voltage_Max | 3.60000 |
| Supply_Voltage_Min | 3.00000 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
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