WED9LAPC2C16P8BI
Synchronous DRAM, 4MX32, CMOS, PBGA153Manufacturer: Microsemi Corporation
Categories: DRAMs
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Microsemi Corporation WED9LAPC2C16P8BI is a 128Mb Synchronous DRAM featuring a 4Mx32 memory organization. This CMOS component operates with a 3.3V nominal supply voltage, ranging from 3.135V to 3.465V, and supports an extended industrial temperature range of -40°C to +85°C. The memory utilizes a four-bank page burst access mode and incorporates auto/self-refresh capabilities. Housed in a 153-ball PBGA (R-PBGA-B153) package with a 1.27mm terminal pitch, it is designed for surface mounting. This component is suitable for applications in networking, industrial control, and consumer electronics.
Additional Information
Series: WED9LAPC2C16RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 22.0000 |
| Width | 14.0000 |
| Technology | CMOS |
| Access_Mode | FOUR BANK PAGE BURST |
| Additional_Feature | AUTO/SELF REFRESH |
| JESD_30_Code | R-PBGA-B153 |
| Memory_Density | 134217728.0000000000000000 |
| Memory_IC_Type | SYNCHRONOUS DRAM |
| Memory_Organization | 4MX32 |
| Memory_Width | 32 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 153 |
| Number_of_Words | 4194304.0000000000000000 |
| Number_of_Words_Code | 4M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 1.8500 |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 3.46500 |
| Supply_Voltage_Min | 3.13500 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
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