WED9LAPC2C16P8BC
Synchronous DRAM, 4MX32, CMOS, PBGA153Manufacturer: Microsemi Corporation
Categories: DRAMs
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Microsemi Corporation WED9LAPC2C16P8BC is a 128Mb Synchronous DRAM with a 4Mx32 organization, operating in a CMOS technology. This component features a FOUR BANK PAGE BURST access mode and supports AUTO/SELF REFRESH functionality. The WED9LAPC2C16 series device is housed in a 153-ball PBGA (R-PBGA-B153) package with a 1.270mm terminal pitch. It operates within a temperature range of 0°C to 70°C and a supply voltage range of 3.135V to 3.465V, with a nominal 3.3V. This surface-mount device is suitable for applications in networking, telecommunications, and industrial control systems requiring high-speed memory solutions.
Additional Information
Series: WED9LAPC2C16RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 22.0000 |
| Width | 14.0000 |
| Technology | CMOS |
| Access_Mode | FOUR BANK PAGE BURST |
| Additional_Feature | AUTO/SELF REFRESH |
| JESD_30_Code | R-PBGA-B153 |
| Memory_Density | 134217728.0000000000000000 |
| Memory_IC_Type | SYNCHRONOUS DRAM |
| Memory_Organization | 4MX32 |
| Memory_Width | 32 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 153 |
| Number_of_Words | 4194304.0000000000000000 |
| Number_of_Words_Code | 4M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 1.8500 |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 3.46500 |
| Supply_Voltage_Min | 3.13500 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
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