WED3DL324V12BC
Synchronous DRAM Module, 4MX32, 8ns, CMOS, PBGA119Manufacturer: Microsemi Corporation
Categories: DRAMs
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The Microsemi Corporation WED3DL324V12BC is a 128 Mbit Synchronous DRAM Module from the WED3DL324 series. This CMOS component features a 4Mx32 memory organization with a 32-bit data width, supporting a four-bank page burst access mode. It offers an 8ns maximum access time and operates synchronously. The module includes auto and self-refresh functionalities, making it suitable for applications requiring efficient memory management. This surface-mount device is housed in a 119-ball PBGA (Plastic Ball Grid Array) package and operates within a 3.0V to 3.6V supply voltage range, with a nominal voltage of 3.3V. It is designed for operation between 0°C and 70°C. This component finds application in industrial, defense, and aerospace systems.
Additional Information
Series: WED3DL324RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| Access_Mode | FOUR BANK PAGE BURST |
| Access_Time_Max | 8.0000000000000000 |
| Additional_Feature | AUTO/SELF REFRESH |
| JESD_30_Code | R-PBGA-B119 |
| Memory_Density | 134217728.0000000000000000 |
| Memory_IC_Type | SYNCHRONOUS DRAM MODULE |
| Memory_Organization | 4MX32 |
| Memory_Width | 32 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 119 |
| Number_of_Words | 4194304.0000000000000000 |
| Number_of_Words_Code | 4M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 2.7900 |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 3.60000 |
| Supply_Voltage_Min | 3.00000 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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