W3HG2256M64ECEU665D4IMG
DDR DRAM Module, 512MX64, 0.45ns, CMOSManufacturer: Microsemi Corporation
Categories: DRAMs
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Microsemi Corporation W3HG2256M64ECEU665D4IMG is a DDR DRAM Module from the W3HG2256M64 series. This component features a memory organization of 512M x 64, delivering a total memory density of 34.36 Gb. It operates synchronously with a maximum access time of 0.45 ns and a CMOS technology. The module supports Dual Bank Page Burst access mode and includes auto/self refresh capabilities. Its operating temperature range is -40°C to 85°C, with a supply voltage range of 1.70V to 1.90V, nominally 1.8V. This DIMM package is suitable for applications in computing, networking, and industrial systems requiring high-speed data storage.
Additional Information
Series: W3HG2256M64RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| Access_Mode | DUAL BANK PAGE BURST |
| Access_Time_Max | 0.4500000000000000 |
| Additional_Feature | AUTO/SELF REFRESH |
| JESD_30_Code | R-XDMA-N200 |
| Memory_Density | 34359738368.0000000000000000 |
| Memory_IC_Type | DDR DRAM MODULE |
| Memory_Organization | 512MX64 |
| Memory_Width | 64 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 200 |
| Number_of_Words | 536870912.0000000000000000 |
| Number_of_Words_Code | 512M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | UNSPECIFIED |
| Package_Code | DIMM |
| Package_Shape | Rectangular |
| Package_Style | MICROELECTRONIC ASSEMBLY |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 1.90000 |
| Supply_Voltage_Min | 1.70000 |
| Supply_Voltage_Nom | 1.8 |
| Surface_Mount | No |
| Terminal_Form | NO LEAD |
| Terminal_Position | Dual |
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