W3HG2256M64ECEU534D4IMG
DDR DRAM Module, 512MX64, 0.5ns, CMOSManufacturer: Microsemi Corporation
Categories: DRAMs
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Microsemi Corporation W3HG2256M64 is a DDR DRAM Module with a memory organization of 512M x 64. This component features a maximum access time of 0.5ns and operates with CMOS technology. It supports synchronous operation, dual bank page burst access mode, and includes auto/self refresh capabilities. The module has a memory density of 34Gbits. Typical applications include networking equipment and industrial automation systems where high-speed memory is critical. The operating temperature range is -40°C to +85°C, with a supply voltage nominal of 1.8V, and a maximum of 1.90V. This Microsemi Corporation component is housed in a DIMM package.
Additional Information
Series: W3HG2256M64RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| Access_Mode | DUAL BANK PAGE BURST |
| Access_Time_Max | 0.5000000000000000 |
| Additional_Feature | AUTO/SELF REFRESH |
| JESD_30_Code | R-XDMA-N200 |
| Memory_Density | 34359738368.0000000000000000 |
| Memory_IC_Type | DDR DRAM MODULE |
| Memory_Organization | 512MX64 |
| Memory_Width | 64 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 200 |
| Number_of_Words | 536870912.0000000000000000 |
| Number_of_Words_Code | 512M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | UNSPECIFIED |
| Package_Code | DIMM |
| Package_Shape | Rectangular |
| Package_Style | MICROELECTRONIC ASSEMBLY |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 1.90000 |
| Supply_Voltage_Min | 1.70000 |
| Supply_Voltage_Nom | 1.8 |
| Surface_Mount | No |
| Terminal_Form | NO LEAD |
| Terminal_Position | Dual |
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