W3HG2128M64EEU403ED4IMG
DDR DRAM Module, 256MX64, 0.6ns, CMOS, PDMA200Manufacturer: Microsemi Corporation
Categories: DRAMs
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Microsemi Corporation W3HG2128M64EEU403ED4IMG is a DDR DRAM module from the W3HG2128 series. This component features a memory organization of 256Mx64, providing a total density of 17.18 gigabytes. It operates with a maximum clock frequency of 200 MHz and offers an access time of 0.6 nanoseconds. The module utilizes CMOS technology and supports common I/O with 3-state output characteristics. Designed for a supply voltage of 1.8V, it operates across a temperature range of -40°C to +85°C. The 200-terminal plastic/epoxy package is a DIMM configuration. This component is suitable for applications in high-performance computing, data centers, and networking infrastructure.
Additional Information
Series: W3HG2128RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| Access_Time_Max | 0.6000000000000000 |
| Clock_Frequency_Max | 200.00000 |
| I_O_Type | COMMON |
| JESD_30_Code | R-PDMA-N200 |
| Memory_Density | 17179869184.0000000000000000 |
| Memory_IC_Type | DDR DRAM MODULE |
| Memory_Organization | 256MX64 |
| Memory_Width | 64 |
| Number_of_Terminals | 200 |
| Number_of_Words | 268435456.0000000000000000 |
| Number_of_Words_Code | 256M |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | -40.0 |
| Output_Characteristics | 3-State |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | DIMM |
| Package_Equivalence_Code | DIMM200,24 |
| Package_Shape | Rectangular |
| Package_Style | MICROELECTRONIC ASSEMBLY |
| Refresh_Cycles | 8192 |
| Standby_Current_Max | 0.112000000000000 |
| Supply_Current_Max | 3280.000000000000000 |
| Supply_Voltage_Nom | 1.8 |
| Surface_Mount | No |
| Terminal_Form | NO LEAD |
| Terminal_Pitch | 0.600 |
| Terminal_Position | Dual |
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