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W3HG128M72AEF806F1MBG

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W3HG128M72AEF806F1MBG

DDR DRAM Module, 256MX4, CMOS

Manufacturer: Microsemi Corporation

Categories: DRAMs

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Microsemi Corporation W3HG128M72AEF806F1MBG is a 1.7V to 1.9V DDR DRAM Module featuring a 256M x 4 memory organization. This CMOS component operates synchronously with a dual bank page burst access mode and supports self-contained refresh. The module's substantial 1,073,741,824-bit (1 Gbit) density is organized into 268,435,456 words, each 4 bits wide. Operating within a temperature range of 0°C to 85°C, this microelectronic assembly is suitable for demanding applications in sectors such as aerospace, defense, and industrial automation. The W3HG128M72 series component adheres to JESD-30 Code R-XDMA-N240 specifications and is packaged as a 240-terminal DIMM.

Additional Information

Series: W3HG128M72RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:
Technical Details:
Width7.1400
TechnologyCMOS
Length133.3500
Access_ModeDUAL BANK PAGE BURST
Additional_FeatureSELF CONTAINED REFRESH; WD-MAX
JESD_30_CodeR-XDMA-N240
Memory_Density1073741824.0000000000000000
Memory_IC_TypeDDR DRAM MODULE
Memory_Organization256MX4
Memory_Width4
Number_of_Functions1
Number_of_Ports1
Number_of_Terminals240
Number_of_Words268435456.0000000000000000
Number_of_Words_Code256M
Operating_ModeSynchronous
Operating_Temperature_Max85.0
Operating_Temperature_Min0.0
Package_Body_MaterialUNSPECIFIED
Package_CodeDIMM
Package_ShapeRectangular
Package_StyleMICROELECTRONIC ASSEMBLY
Seated_Height_Max30.5000
Self_RefreshYes
Supply_Voltage_Max1.90000
Supply_Voltage_Min1.70000
Supply_Voltage_Nom1.8
Surface_MountNo
Terminal_FormNO LEAD
Terminal_Pitch1.000
Terminal_PositionDual

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