W3H64M72E-SBC
DDR2 DRAM, 64MX72, CMOS, PBGA208Manufacturer: Microsemi Corporation
Categories: DRAMs
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Microsemi Corporation W3H64M72E-SBC is a DDR2 DRAM component from the W3H64M72 series. This synchronous memory IC features a 64M x 72 organization, providing a substantial memory density of 4831838208 bits. It operates within a voltage range of 1.70V to 1.90V, with a nominal supply of 1.8V, and supports CMOS technology. The component offers multi-bank page burst access mode and includes auto/self-refresh functionality. Housed in a rectangular PBGA208 package (R-PBGA-B208), it presents a grid array of 208 bottom-mounted ball terminals. Operating temperature spans from 0.0°C to 70.0°C. This surface-mount device finds application in sectors such as telecommunications and industrial automation.
Additional Information
Series: W3H64M72RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| Access_Mode | MULTI BANK PAGE BURST |
| Additional_Feature | AUTO/SELF REFRESH |
| JESD_30_Code | R-PBGA-B208 |
| Memory_Density | 4831838208.0000000000000000 |
| Memory_IC_Type | DDR2 DRAM |
| Memory_Organization | 64MX72 |
| Memory_Width | 72 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 208 |
| Number_of_Words | 67108864.0000000000000000 |
| Number_of_Words_Code | 64M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 1.90000 |
| Supply_Voltage_Min | 1.70000 |
| Supply_Voltage_Nom | 1.8 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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