W3H32M72E-667SBM
DDR DRAM Module, 32MX72, 0.45ns, CMOS, PBGA208Manufacturer: Microsemi Corporation
Categories: DRAMs
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Microsemi Corporation W3H32M72E-667SBM is a DDR DRAM Module featuring a 32Mx72 organization with a maximum access time of 0.45ns. This component utilizes CMOS technology and is housed in a 208-ball PBGA (R-PBGA-B208) package with a 1.00mm terminal pitch. It operates with a nominal supply voltage of 1.8V and supports a maximum clock frequency of 333MHz. The module offers 8192 refresh cycles and is designed for surface mounting. Its operating temperature range spans from -55°C to +125°C, making it suitable for demanding applications in industries such as aerospace, defense, and high-performance computing. The W3H32 series component provides a memory density of 2415919104 bits.
Additional Information
Series: W3H32RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| Access_Time_Max | 0.4500000000000000 |
| Clock_Frequency_Max | 333.00000 |
| I_O_Type | COMMON |
| JESD_30_Code | R-PBGA-B208 |
| Memory_Density | 2415919104.0000000000000000 |
| Memory_IC_Type | DDR DRAM MODULE |
| Memory_Organization | 32MX72 |
| Memory_Width | 72 |
| Number_of_Terminals | 208 |
| Number_of_Words | 33554432.0000000000000000 |
| Number_of_Words_Code | 32M |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Output_Characteristics | 3-State |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA208,11X19,40 |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Refresh_Cycles | 8192 |
| Standby_Current_Max | 0.035000000000000 |
| Supply_Current_Max | 1700.000000000000000 |
| Supply_Voltage_Nom | 1.8 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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