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W3H264M16E-400SBI

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W3H264M16E-400SBI

DDR2 DRAM, 128MX16, 0.8ns, CMOS, PBGA79

Manufacturer: Microsemi Corporation

Categories: DRAMs

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Microsemi Corporation's W3H264M16E-400SBI is a 2Gb DDR2 DRAM component organized as 128M x 16 bits. This CMOS device operates with a maximum access time of 0.8ns, supporting synchronous operation with dual bank page burst access mode. Features include auto/self refresh capabilities, LG-MAX, WD-MAX, and HT-CALCULATED seated height. The component is housed in a 79-ball PBGA package with a terminal pitch of 1.27mm. It operates within a temperature range of -40°C to 85°C and requires a supply voltage between 1.7V and 1.9V, with a nominal voltage of 1.8V. This memory solution is suitable for applications in networking, industrial, and consumer electronics where high-speed data buffering and storage are critical. The R-PBGA-B79 package style is a rectangular grid array with bottom-mounted ball terminals.

Additional Information

Series: W3H264M16RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:
Technical Details:
Length14.1000
Width11.1000
TechnologyCMOS
Access_ModeDUAL BANK PAGE BURST
Access_Time_Max0.8000000000000000
Additional_FeatureAUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
JESD_30_CodeR-PBGA-B79
Memory_Density2147483648.0000000000000000
Memory_IC_TypeDDR2 DRAM
Memory_Organization128MX16
Memory_Width16
Number_of_Functions1
Number_of_Ports1
Number_of_Terminals79
Number_of_Words134217728.0000000000000000
Number_of_Words_Code128M
Operating_ModeSynchronous
Operating_Temperature_Max85.0
Operating_Temperature_Min-40.0
Package_Body_MaterialPLASTIC/EPOXY
Package_CodeBGA
Package_ShapeRectangular
Package_StyleGRID ARRAY
Seated_Height_Max2.8700
Self_RefreshYes
Supply_Voltage_Max1.90000
Supply_Voltage_Min1.70000
Supply_Voltage_Nom1.8
Surface_MountYes
Terminal_FormBall
Terminal_Pitch1.270
Terminal_PositionBottom

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