W3H128M64E2-533SBM
DDR2 DRAM Module, 128MX64, 0.5ns, CMOS, PDMA208Manufacturer: Microsemi Corporation
Categories: DRAMs
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The Microsemi Corporation W3H128M64E2-533SBM is a DDR2 DRAM module with a memory organization of 128M x 64. This component features a maximum access time of 0.5ns and operates using CMOS technology. It supports auto/self refresh, LG-MAX, and WD-MAX functionalities. The module is designed with a PDMA208 package, utilizing a BGA form factor with a terminal pitch of 1.00mm. This device operates within a temperature range of -55°C to 125°C and requires a supply voltage between 1.70V and 1.90V, with a nominal of 1.8V. Its memory density is 8589934592 bits. This component is suitable for applications in telecommunications, industrial automation, and high-performance computing.
Additional Information
Series: W3H128M64RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 22.1500 |
| Width | 16.1500 |
| Technology | CMOS |
| Access_Mode | MULTI BANK PAGE BURST |
| Access_Time_Max | 0.5000000000000000 |
| Additional_Feature | AUTO/SELF REFRESH; LG-MAX; WD-MAX |
| JESD_30_Code | R-XDMA-N184 |
| Memory_Density | 8589934592.0000000000000000 |
| Memory_IC_Type | DDR2 DRAM MODULE |
| Memory_Organization | 128MX64 |
| Memory_Width | 64 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 208 |
| Number_of_Words | 134217728.0000000000000000 |
| Number_of_Words_Code | 128M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | MICROELECTRONIC ASSEMBLY |
| Seated_Height_Max | 5.1500 |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 1.90000 |
| Supply_Voltage_Min | 1.70000 |
| Supply_Voltage_Nom | 1.8 |
| Surface_Mount | No |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Dual |
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