W3H128M64E-400SBC
DDR2 DRAM, 128MX64, 0.6ns, CMOS, PBGA208Manufacturer: Microsemi Corporation
Categories: DRAMs
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Microsemi Corporation W3H128M64 series DDR2 DRAM, part number W3H128M64E-400SBC, offers 8Gb of memory capacity with a 128M x 64 organization. This CMOS component operates synchronously with a maximum access time of 0.6ns and supports auto/self refresh, LG-MAX, and WD-MAX features. Housed in a 208-ball PBGA package (R-PBGA-B208) with a 1.00mm terminal pitch, it is designed for surface mounting. The operating voltage range is 1.70V to 1.90V, with a nominal 1.8V, and it operates within a temperature range of 0°C to 70°C. This component finds application in telecommunications, industrial automation, and high-performance computing systems.
Additional Information
Series: W3H128M64RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 22.1500 |
| Width | 16.1500 |
| Technology | CMOS |
| Access_Mode | MULTI BANK PAGE BURST |
| Access_Time_Max | 0.6000000000000000 |
| Additional_Feature | AUTO/SELF REFRESH; LG-MAX; WD-MAX |
| JESD_30_Code | R-PBGA-B208 |
| Memory_Density | 8589934592.0000000000000000 |
| Memory_IC_Type | DDR2 DRAM |
| Memory_Organization | 128MX64 |
| Memory_Width | 64 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 208 |
| Number_of_Words | 134217728.0000000000000000 |
| Number_of_Words_Code | 128M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 5.1500 |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 1.90000 |
| Supply_Voltage_Min | 1.70000 |
| Supply_Voltage_Nom | 1.8 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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