W3DG6464FV10D1I-GG
Synchronous DRAM Module, 64MX64, 6ns, CMOSManufacturer: Microsemi Corporation
Categories: DRAMs
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The Microsemi Corporation W3DG6464FV10D1I-GG is a high-density Synchronous DRAM Module from the W3DG6464 series. This 64Mx64 organization provides 4Gb of memory capacity, operating with a maximum access time of 6ns. It features dual bank page burst access mode and supports auto/self refresh functions. Built on CMOS technology, this module operates within a temperature range of -40°C to 85°C and utilizes a supply voltage between 3.0V and 3.6V, with a nominal 3.3V. The 144-terminal DIMM package is designed for robust performance in demanding applications. This component is commonly found in telecommunications infrastructure, industrial control systems, and advanced computing platforms.
Additional Information
Series: W3DG6464RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| Access_Mode | DUAL BANK PAGE BURST |
| Access_Time_Max | 6.0000000000000000 |
| Additional_Feature | AUTO/SELF REFRESH |
| JESD_30_Code | R-XZMA-N144 |
| Memory_Density | 4294967296.0000000000000000 |
| Memory_IC_Type | SYNCHRONOUS DRAM MODULE |
| Memory_Organization | 64MX64 |
| Memory_Width | 64 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 144 |
| Number_of_Words | 67108864.0000000000000000 |
| Number_of_Words_Code | 64M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | UNSPECIFIED |
| Package_Code | DIMM |
| Package_Shape | Rectangular |
| Package_Style | MICROELECTRONIC ASSEMBLY |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 3.60000 |
| Supply_Voltage_Min | 3.00000 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | No |
| Terminal_Form | NO LEAD |
| Terminal_Position | ZIG-ZAG |
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