W3DG6418V75D2SG
Synchronous DRAM Module, 16MX64, CMOSManufacturer: Microsemi Corporation
Categories: DRAMs
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The Microsemi Corporation W3DG6418V75D2SG is a 16Mx64 Synchronous DRAM module operating in CMOS technology. This module, part of the W3DG6418 series, features a 168-pin DIMM package with Dual Inline Memory Module (DIMM) style packaging. It supports a four-bank page burst access mode and includes auto/self-refresh functionality, with a specified operating temperature range of 0.0°C to 70.0°C. The module is designed for a supply voltage between 3.0V and 3.6V, with a nominal voltage of 3.3V. The memory organization is 16Mx64, providing a total memory density of 1073741824 bits. This component is commonly utilized in computing, networking, and industrial applications requiring high-speed memory solutions.
Additional Information
Series: W3DG6418RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| Access_Mode | FOUR BANK PAGE BURST |
| Additional_Feature | AUTO/SELF REFRESH |
| JESD_30_Code | R-XDMA-N168 |
| Memory_Density | 1073741824.0000000000000000 |
| Memory_IC_Type | SYNCHRONOUS DRAM MODULE |
| Memory_Organization | 16MX64 |
| Memory_Width | 64 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 168 |
| Number_of_Words | 16777216.0000000000000000 |
| Number_of_Words_Code | 16m |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | UNSPECIFIED |
| Package_Code | DIMM |
| Package_Shape | Rectangular |
| Package_Style | MICROELECTRONIC ASSEMBLY |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 3.60000 |
| Supply_Voltage_Min | 3.00000 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | No |
| Terminal_Form | NO LEAD |
| Terminal_Position | Dual |
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