W332M64V-125SBC
Synchronous DRAM, 32MX64, 6ns, CMOS, PBGA208Manufacturer: Microsemi Corporation
Categories: DRAMs
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Microsemi Corporation W332M64 series synchronous DRAM, part number W332M64V-125SBC, offers a 2Gb memory density with a 32M x 64 organization. This CMOS component features a maximum access time of 6 ns and operates in a multi-bank page burst mode. Key functionalities include auto/self refresh, LG-MAX, and WD-MAX capabilities. The device is housed in a 208-ball PBGA (R-PBGA-B208) package with a 1.00 mm terminal pitch and supports a supply voltage range of 3.0V to 3.6V. Operating temperature spans from 0°C to 70°C. This component is suitable for applications in computing, networking, and industrial automation.
Additional Information
Series: W332M64RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 22.1500 |
| Width | 13.1500 |
| Technology | CMOS |
| Access_Mode | MULTI BANK PAGE BURST |
| Access_Time_Max | 6.0000000000000000 |
| Additional_Feature | AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED |
| JESD_30_Code | R-PBGA-B208 |
| Memory_Density | 2147483648.0000000000000000 |
| Memory_IC_Type | SYNCHRONOUS DRAM |
| Memory_Organization | 32MX64 |
| Memory_Width | 64 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 208 |
| Number_of_Words | 33554432.0000000000000000 |
| Number_of_Words_Code | 32M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 2.7700 |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 3.60000 |
| Supply_Voltage_Min | 3.00000 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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