MT29F512G08EBLGEB27C3WC1-M
IC FLASH 512GBIT DIEManufacturer: Micron Technology Inc.
Categories: Memory
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Micron Technology Inc. delivers the MT29F512G08EBLGEB27C3WC1-M, a high-density 512Gbit NAND Flash memory die. This component is engineered for demanding applications requiring substantial non-volatile storage. Its organization is 64G x 8, providing a robust memory architecture. The MT29F512G08EBLGEB27C3WC1-M finds application in various industrial sectors, including automotive, data centers, and consumer electronics, where reliable and high-capacity storage solutions are paramount. The die form factor is suitable for advanced packaging technologies.
Additional Information
Series: -RoHS Status: unknownManufacturer Lead Time: 2 week(s)Product Status: ActivePackaging: BoxDownload Free CAD Model:
Technical Details:
| Packaging | Box |
| Package / Case | Die |
| Memory Size | 512Gbit |
| Memory Format | FLASH |
| Supplier Device Package | Die |
| Memory Organization | 64G x 8 |
| Programmable | Not Verified |
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