MT29F512G08EBLGEB27C3WC1-F
IC FLASH 512GBIT DIEManufacturer: Micron Technology Inc.
Categories: Memory
Quality Control: Learn More
Micron Technology Inc. presents the MT29F512G08EBLGEB27C3WC1-F, a high-density 512Gbit NAND Flash memory die. This component is organized as 64 Gigawords x 8 bits, offering substantial data storage capacity. Designed for advanced memory applications, this die-level product is suitable for integration into custom board designs and high-performance systems. Its NAND Flash architecture ensures reliable data retention and efficient read/write operations. This memory solution finds application in areas requiring significant storage density and robust performance, such as advanced computing, data center infrastructure, and high-end consumer electronics. The component is supplied in die form, intended for specialized manufacturing processes.
Additional Information
Series: -RoHS Status: unknownManufacturer Lead Time: 2 week(s)Product Status: ActivePackaging: BoxDownload Free CAD Model:
Technical Details:
| Packaging | Box |
| Package / Case | Die |
| Memory Size | 512Gbit |
| Memory Format | FLASH |
| Supplier Device Package | Die |
| Memory Organization | 64G x 8 |
| Programmable | Not Verified |
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