MT29F512G08EBHAFB17A3WC1-F
TLC 512G DIE 64GX8Manufacturer: Micron Technology Inc.
Categories: Memory
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Micron Technology Inc. presents the MT29F512G08EBHAFB17A3WC1-F, a 512Gb NAND Flash memory die. This component, organized as 64G x 8, utilizes advanced TLC (Triple-Level Cell) technology for high-density data storage. Designed for demanding applications, it offers robust performance and reliability. The MT29F512G08EBHAFB17A3WC1-F is suitable for use in data centers, automotive systems, industrial automation, and consumer electronics where high-capacity, non-volatile storage is critical. This die is provided in tray packaging.
Additional Information
Series: RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: TrayDownload Free CAD Model:
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