MT29F4G01ABAFDM70A3WC1
IC FLASH 4GBIT SPI DIEManufacturer: Micron Technology Inc.
Categories: Memory
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Micron Technology Inc.'s MT29F4G01ABAFDM70A3WC1 is a 4Gbit NAND Flash memory die designed for high-density storage applications. This non-volatile memory component features a Serial Peripheral Interface (SPI) for efficient data transfer, making it suitable for embedded systems and portable devices. The memory organization is 4G x 1, and it operates within a voltage range of 2.7V to 3.6V. With an operating temperature range of -40°C to 85°C, it is engineered for robust performance in demanding environments. This die-level product is supplied in bulk packaging and is intended for surface mount applications. Its capabilities lend themselves to use in consumer electronics, industrial automation, and telecommunications sectors.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 2 week(s)Product Status: ActivePackaging: BulkDownload Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | Die |
| Mounting Type | Surface Mount |
| Memory Size | 4Gbit |
| Memory Type | Non-Volatile |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Voltage - Supply | 2.7V ~ 3.6V |
| Technology | FLASH - NAND |
| Memory Format | FLASH |
| Supplier Device Package | Die |
| Write Cycle Time - Word, Page | - |
| Memory Interface | SPI |
| Memory Organization | 4G x 1 |
| Programmable | Not Verified |
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