MT29F32G08CBEDBL83A3WC1
IC FLASH 32GBIT PARALLEL DIEManufacturer: Micron Technology Inc.
Categories: Memory
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Micron Technology Inc. MT29F32G08CBEDBL83A3WC1 is a 32Gbit NAND Flash memory die designed for high-density data storage applications. Featuring a parallel interface and organized as 4G x 8, this non-volatile memory component utilizes advanced FLASH-NAND technology for reliable data retention. With a voltage supply range of 2.7V to 3.6V, it operates within an ambient temperature range of 0°C to 70°C. The component is supplied in a Die package, suitable for advanced surface mount integration. This memory solution is commonly employed in consumer electronics, automotive systems, and industrial automation where robust and high-capacity flash storage is critical.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDownload Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | Die |
| Mounting Type | Surface Mount |
| Memory Size | 32Gbit |
| Memory Type | Non-Volatile |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Voltage - Supply | 2.7V ~ 3.6V |
| Technology | FLASH - NAND |
| Memory Format | FLASH |
| Supplier Device Package | Die |
| Write Cycle Time - Word, Page | - |
| Memory Interface | Parallel |
| Memory Organization | 4G x 8 |
| Programmable | Not Verified |
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