MT29F256G08EBCCGB16E3WC1-M
IC FLASH 256GBIT DIEManufacturer: Micron Technology Inc.
Categories: Memory
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Micron Technology Inc. presents the MT29F256G08EBCCGB16E3WC1-M, a 256Gbit NAND Flash memory die. This component is organized as 32G x 8 and is designed for high-density data storage applications. Its die-level packaging is suitable for advanced semiconductor assembly processes. This memory solution is integral to a wide range of demanding industries including automotive, industrial automation, and consumer electronics, where robust and high-capacity non-volatile storage is critical. The MT29F256G08EBCCGB16E3WC1-M leverages proven NAND Flash technology to deliver reliable performance for complex embedded systems and data-intensive devices.
Additional Information
Series: -RoHS Status: unknownManufacturer Lead Time: 2 week(s)Product Status: ActivePackaging: BoxDownload Free CAD Model:
Technical Details:
| Packaging | Box |
| Package / Case | Die |
| Memory Size | 256Gbit |
| Memory Format | FLASH |
| Supplier Device Package | Die |
| Memory Organization | 32G x 8 |
| Programmable | Not Verified |
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