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MT29F256G08EBCAGB16A3WC1-R

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MT29F256G08EBCAGB16A3WC1-R

IC FLASH 256GBIT PARALLEL DIE

Manufacturer: Micron Technology Inc.

Categories: Memory

Quality Control: Learn More

Micron Technology Inc. MT29F256G08EBCAGB16A3WC1-R is a 256Gbit NAND Flash memory device organized as 32G x 8. This non-volatile memory utilizes a parallel interface with a clock frequency of 333 MHz, supporting TLC (Triple-Level Cell) technology. The device is supplied as a Die, suitable for surface mount applications within an operating temperature range of 0°C to 70°C (TA). This component is commonly found in applications requiring high-density data storage, including consumer electronics, networking equipment, and industrial control systems. The voltage supply range for this part is 2.7V to 3.6V.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Bulk
Technical Details:
PackagingBulk
Package / CaseDie
Mounting TypeSurface Mount
Memory Size256Gbit
Memory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)
Voltage - Supply2.7V ~ 3.6V
TechnologyFLASH - NAND (TLC)
Clock Frequency333 MHz
Memory FormatFLASH
Supplier Device PackageDie
Write Cycle Time - Word, Page-
Memory InterfaceParallel
Memory Organization32G x 8
ProgrammableNot Verified

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