MT29F256G08CBCBBL06B3WC1
IC FLASH 256GBIT PARALLEL DIEManufacturer: Micron Technology Inc.
Categories: Memory
Quality Control: Learn More
Micron Technology Inc. presents the MT29F256G08CBCBBL06B3WC1, a 256Gbit NAND Flash memory die. This component utilizes Multi-Level Cell (MLC) technology and features a parallel interface for high-speed data transfer. Organized as 32G x 8, this non-volatile memory solution is suitable for demanding applications across various industries, including automotive, industrial automation, and consumer electronics. The device operates within a voltage range of 2.7V to 3.6V and is supplied in bulk packaging. Its surface mount die package is designed for integration into compact electronic systems. The operating temperature range for this component is 0°C to 70°C (TA).
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDownload Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | Die |
| Mounting Type | Surface Mount |
| Memory Size | 256Gbit |
| Memory Type | Non-Volatile |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Voltage - Supply | 2.7V ~ 3.6V |
| Technology | FLASH - NAND (MLC) |
| Memory Format | FLASH |
| Supplier Device Package | Die |
| Write Cycle Time - Word, Page | - |
| Memory Interface | Parallel |
| Memory Organization | 32G x 8 |
| Programmable | Not Verified |
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