WEDPZ512K72S-133BC
SRAM Module, 512KX72, 4.2ns, CMOS, PBGA152Manufacturer: Microchip Technology
Categories: SRAMs
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Microchip Technology's WEDPZ512K72 series SRAM module, part number WEDPZ512K72S-133BC, offers a 512K x 72 memory organization with a maximum access time of 4.2ns. This CMOS component operates synchronously and is housed in a 152-ball PBGA package with a 1.27mm terminal pitch and a maximum seated height of 2.64mm. The supply voltage ranges from 2.375V to 2.625V, with a nominal value of 2.5V. Operating temperature spans from 0°C to 70°C. The device supports user configuration for alternative memory layouts, including 2M x 18. Applications for this high-density memory module can be found in telecommunications, networking equipment, and high-performance computing systems.
Additional Information
Series: WEDPZ512K72RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 23.1000 |
| Width | 17.1000 |
| Technology | CMOS |
| Access_Time_Max | 4.2000000000000000 |
| Additional_Feature | USER CONFIGURABLE AS 2M X 18; LG_MAX; WD_MAX; SEATED HT-CALCULATED |
| JESD_30_Code | R-PBGA-B152 |
| Memory_Density | 37748736.0000000000000000 |
| Memory_IC_Type | SRAM MODULE |
| Memory_Organization | 512KX72 |
| Memory_Width | 72 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 152 |
| Number_of_Words | 524288.0000000000000000 |
| Number_of_Words_Code | 512k |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Parallel_Serial | Parallel |
| Seated_Height_Max | 2.6400 |
| Supply_Voltage_Max | 2.62500 |
| Supply_Voltage_Min | 2.37500 |
| Supply_Voltage_Nom | 2.5 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
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