WED2DL32512V38BC
Standard SRAM, 512KX32, 3.8ns, CMOS, PBGA119Manufacturer: Microchip Technology
Categories: SRAMs
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Microchip Technology's WED2DL32512V38BC is a standard synchronous SRAM with a memory organization of 512K x 32, providing a total density of 16 Megabits. This CMOS component operates with a maximum access time of 3.8 nanoseconds and features a 3.3V nominal supply voltage range (3.135V to 3.6V). The WED2DL32512 series component is housed in a 119-ball PBGA (Plastic Ball Grid Array) package with a 1.27mm terminal pitch, measuring 14.15mm x 22.15mm with a maximum seated height of 1.831mm. Key features include LG-MAX and WD-MAX capabilities. This memory solution is suitable for applications in industrial, networking, and consumer electronics sectors.
Additional Information
Series: WED2DL32512RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 22.1500 |
| Width | 14.1500 |
| Technology | CMOS |
| Access_Time_Max | 3.8000000000000000 |
| Additional_Feature | LG-MAX; WD-MAX; SEATED HGT-CALCULATED |
| JESD_30_Code | R-PBGA-B119 |
| Memory_Density | 16777216.0000000000000000 |
| Memory_IC_Type | STANDARD SRAM |
| Memory_Organization | 512KX32 |
| Memory_Width | 32 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 119 |
| Number_of_Words | 524288.0000000000000000 |
| Number_of_Words_Code | 512k |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Parallel_Serial | Parallel |
| Seated_Height_Max | 1.8310 |
| Supply_Voltage_Max | 3.60000 |
| Supply_Voltage_Min | 3.13500 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
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