LXP1004-23-2
SI PIN NON HERMETIC PLASTIC SMTManufacturer: Microchip Technology
Categories: RF Diodes
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Microchip Technology LXP1004-23-2 is a non-hermetic plastic Surface Mount Device (SMD) PIN diode, configured as a single pair in series. This component is designed for RF applications requiring high isolation and low distortion. Key specifications include a maximum reverse voltage of 20V and a continuous forward current rating of 10mA. The diode exhibits a typical capacitance of 0.75pF at 20V and 1MHz, and a low on-state resistance of 600mOhm at 10mA and 100MHz. With a maximum power dissipation of 250mW, it is suitable for operation across a broad temperature range of -55°C to 125°C. The component is housed in a compact SOT-23-3 package, commonly utilized in wireless infrastructure, broadband communications, and satellite communication systems.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | TO-236-3, SC-59, SOT-23-3 |
| Diode Type | PIN - 1 Pair Series Connection |
| Operating Temperature | -55°C ~ 125°C |
| Capacitance @ Vr, F | 0.75pF @ 20V, 1MHz |
| Resistance @ If, F | 600mOhm @ 10mA, 100MHz |
| Voltage - Peak Reverse (Max) | 20V |
| Supplier Device Package | SOT-23-3 |
| Current - Max | 10 mA |
| Power Dissipation (Max) | 250 mW |
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