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25LC128-E/P

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25LC128-E/P

IC EEPROM 128KBIT SPI 8DIP

Manufacturer: Microchip Technology

Categories: Memory

Quality Control: Learn More

Microchip Technology's 25LC128-E-P is a 128Kbit Serial Peripheral Interface (SPI) EEPROM memory device. This non-volatile memory features a 16K x 8 organization and operates with a clock frequency of up to 10 MHz. Designed for through-hole mounting, it is provided in an 8-PDIP package with a standard 0.300" (7.62mm) pitch. The device supports a wide supply voltage range of 2.5V to 5.5V and an extended operating temperature range of -40°C to 125°C. Write cycle times for word and page operations are specified at 5ms. This component finds application in industrial, automotive, and consumer electronics sectors requiring reliable serial data storage.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 20 week(s)Product Status: ActivePackaging: TubeDatasheet:
Technical Details:
PackagingTube
Package / Case8-DIP (0.300"", 7.62mm)
Mounting TypeThrough Hole
Memory Size128Kbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 125°C (TA)
Voltage - Supply2.5V ~ 5.5V
TechnologyEEPROM
Clock Frequency10 MHz
Memory FormatEEPROM
Supplier Device Package8-PDIP
Write Cycle Time - Word, Page5ms
Memory InterfaceSPI
Memory Organization16K x 8
ProgrammableNot Verified

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An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

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Frequently Asked Questions

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.