W732M32E-66BI
Flash, 32MX32, PBGA153Manufacturer: Microchip Technology
Categories: Flash Memories
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Microchip Technology's W732M32E-66BI is a high-density, 1Gbit NOR-type Flash memory component. Featuring a 32M x 32 memory organization, this device operates synchronously with a programming voltage of 1.8V and a supply voltage range of 1.7V to 1.9V. The W732M32 series component is housed in a 153-ball PBGA (R-PBGA-B153) package with a 1.00mm terminal pitch, suitable for surface-mount applications. It supports both bottom and top boot block configurations. This component is engineered for demanding applications across industrial, automotive, and telecommunications sectors, benefiting from its CMOS technology and an operating temperature range of -40°C to +85°C. The W732M32E-66BI offers robust performance for data storage and program execution.
Additional Information
Series: W732M32RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 17.1000 |
| Type | NOR TYPE |
| Width | 13.1000 |
| Technology | CMOS |
| Additional_Feature | LG-MAX; WD-MAX |
| Boot_Block | BOTTOM/TOP |
| JESD_30_Code | R-PBGA-B153 |
| Memory_Density | 1073741824.0000000000000000 |
| Memory_IC_Type | FLASH |
| Memory_Organization | 32MX32 |
| Memory_Width | 32 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 153 |
| Number_of_Words | 33554432.0000000000000000 |
| Number_of_Words_Code | 32M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Parallel_Serial | Parallel |
| Programming_Voltage | 1.8 |
| Supply_Voltage_Max | 1.90000 |
| Supply_Voltage_Min | 1.70000 |
| Supply_Voltage_Nom | 1.8 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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