5962D9317708VNX
FIFO, 16KX9, 15ns, Asynchronous, CMOSManufacturer: Microchip Technology
Categories: FIFOs
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Microchip Technology's 5962-9317708 is a 16K x 9 asynchronous FIFO buffer fabricated using CMOS technology. This component offers a maximum access time of 15ns and a cycle time of 25ns, facilitating high-speed data buffering. Its memory organization is 16,384 words with a width of 9 bits, providing 147,456 bits of storage. Designed for demanding applications, it operates across a temperature range of -55°C to +125°C with a supply voltage range of 4.5V to 5.5V. The 28-terminal DFP flat pack package, measuring 18.288mm in length and 10.160mm in width with a 1.270mm terminal pitch, is suitable for surface mounting. This device is commonly utilized in aerospace and defense systems where robust performance and reliability are paramount.
Additional Information
Series: 5962-9317708RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 18.2880 |
| Width | 10.1600 |
| Technology | CMOS |
| Access_Time_Max | 15.0000000000000000 |
| Cycle_Time | 25.0000000000000000 |
| JESD_30_Code | R-XDFP-F28 |
| Memory_Density | 147456.0000000000000000 |
| Memory_IC_Type | OTHER FIFO |
| Memory_Organization | 16KX9 |
| Memory_Width | 9 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 28 |
| Number_of_Words | 16384.0000000000000000 |
| Number_of_Words_Code | 16k |
| Operating_Mode | Asynchronous |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Output_Enable | No |
| Package_Body_Material | UNSPECIFIED |
| Package_Code | DFP |
| Package_Shape | Rectangular |
| Package_Style | FlatPack |
| Parallel_Serial | Parallel |
| Screening_Level_Reference_Standard | MIL-PRF-38535 Class V |
| Seated_Height_Max | 3.3000 |
| Supply_Voltage_Max | 5.50000 |
| Supply_Voltage_Min | 4.50000 |
| Supply_Voltage_Nom | 5 |
| Surface_Mount | Yes |
| Terminal_Form | Flat |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Dual |
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