5962D9317705VTX
FIFO, 16KX9, 30ns, Asynchronous, CMOSManufacturer: Microchip Technology
Categories: FIFOs
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Microchip Technology offers the 5962-9317705, a CMOS asynchronous FIFO memory with a 16,384-word by 9-bit organization. This component features a maximum access time of 30ns and a cycle time of 40ns. Its 147,456-bit density and retransmit capability make it suitable for applications requiring high-speed data buffering and flow control. Designed for robust operation, it supports an industrial temperature range from -55°C to +125°C and operates from a 4.5V to 5.5V supply. The 28-lead DIP package utilizes through-hole mounting with a 2.54mm terminal pitch. This device is commonly employed in aerospace, defense, and other high-reliability systems demanding stable and predictable data handling.
Additional Information
Series: 5962-9317705RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 7.6200 |
| Technology | CMOS |
| Access_Time_Max | 30.0000000000000000 |
| Additional_Feature | RETRANSMIT |
| Cycle_Time | 40.0000000000000000 |
| JESD_30_Code | R-XDIP-T28 |
| Memory_Density | 147456.0000000000000000 |
| Memory_IC_Type | OTHER FIFO |
| Memory_Organization | 16KX9 |
| Memory_Width | 9 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 28 |
| Number_of_Words | 16384.0000000000000000 |
| Number_of_Words_Code | 16k |
| Operating_Mode | Asynchronous |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Output_Enable | No |
| Package_Body_Material | UNSPECIFIED |
| Package_Code | DIP |
| Package_Shape | Rectangular |
| Package_Style | IN-LINE |
| Parallel_Serial | Parallel |
| Seated_Height_Max | 5.8400 |
| Supply_Voltage_Max | 5.50000 |
| Supply_Voltage_Min | 4.50000 |
| Supply_Voltage_Nom | 5 |
| Surface_Mount | No |
| Terminal_Form | THROUGH-HOLE |
| Terminal_Pitch | 2.540 |
| Terminal_Position | Dual |
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