5962-9317709VTX
FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28Manufacturer: Microchip Technology
Categories: FIFOs
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The Microchip Technology 5962-9317709 is a 16,384 x 9-bit asynchronous FIFO memory device built on CMOS technology. It offers a maximum access time of 30ns and a cycle time of 40ns. This component features a 16K word depth and a 9-bit width, providing a total memory density of 147,456 bits. Designed for robust operation, it supports an industrial temperature range from -55°C to 125°C. The device is housed in a 28-lead ceramic dual in-line package (CDIP), with a terminal pitch of 2.54mm for through-hole mounting. This high-performance FIFO is suitable for applications in aerospace, defense, and industrial control systems requiring reliable data buffering and transfer.
Additional Information
Series: 5962-9317709RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 27.9400 |
| Width | 7.6200 |
| Technology | CMOS |
| Access_Time_Max | 30.0000000000000000 |
| Cycle_Time | 40.0000000000000000 |
| JESD_30_Code | R-CDIP-T28 |
| Memory_Density | 147456.0000000000000000 |
| Memory_IC_Type | OTHER FIFO |
| Memory_Organization | 16KX9 |
| Memory_Width | 9 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 28 |
| Number_of_Words | 16384.0000000000000000 |
| Number_of_Words_Code | 16k |
| Operating_Mode | Asynchronous |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Output_Enable | No |
| Package_Body_Material | CERAMIC, METAL-SEALED COFIRED |
| Package_Code | DIP |
| Package_Shape | Rectangular |
| Package_Style | IN-LINE |
| Parallel_Serial | Parallel |
| Screening_Level_Reference_Standard | MIL-PRF-38535 Class V |
| Seated_Height_Max | 3.9400 |
| Supply_Voltage_Max | 5.50000 |
| Supply_Voltage_Min | 4.50000 |
| Supply_Voltage_Nom | 5 |
| Surface_Mount | No |
| Terminal_Form | THROUGH-HOLE |
| Terminal_Pitch | 2.540 |
| Terminal_Position | Dual |
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