5962-9317709QNX
FIFO, 16KX9, 30ns, Asynchronous, CMOSManufacturer: Microchip Technology
Categories: FIFOs
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Microchip Technology's 5962-9317709QNX is a high-performance, asynchronous CMOS FIFO memory device from the 5962-9317709 series. Featuring a 16K x 9 organization, it offers a maximum access time of 30ns and a cycle time of 40ns. This device is built for demanding applications, supporting a wide operating temperature range from -55°C to +125°C and a supply voltage of 4.5V to 5.5V. The 28-terminal, rectangular FlatPack (DFP) package, with a terminal pitch of 1.27mm, is designed for surface mounting. Its robust construction and MIL-PRF-38535 Class Q screening make it suitable for aerospace, defense, and high-reliability industrial systems requiring efficient data buffering between asynchronous systems.
Additional Information
Series: 5962-9317709RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 10.1600 |
| Technology | CMOS |
| Length | 18.2880 |
| Access_Time_Max | 30.0000000000000000 |
| Cycle_Time | 40.0000000000000000 |
| JESD_30_Code | R-XDFP-F28 |
| Memory_Density | 147456.0000000000000000 |
| Memory_IC_Type | OTHER FIFO |
| Memory_Organization | 16KX9 |
| Memory_Width | 9 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 28 |
| Number_of_Words | 16384.0000000000000000 |
| Number_of_Words_Code | 16k |
| Operating_Mode | Asynchronous |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Output_Enable | No |
| Package_Body_Material | UNSPECIFIED |
| Package_Code | DFP |
| Package_Shape | Rectangular |
| Package_Style | FlatPack |
| Parallel_Serial | Parallel |
| Screening_Level_Reference_Standard | MIL-PRF-38535 Class Q |
| Seated_Height_Max | 3.3000 |
| Supply_Voltage_Max | 5.50000 |
| Supply_Voltage_Min | 4.50000 |
| Supply_Voltage_Nom | 5 |
| Surface_Mount | Yes |
| Terminal_Form | Flat |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Dual |
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