5962-8956810QNX
FIFO, 4KX9, 15ns, Asynchronous, CMOSManufacturer: Microchip Technology
Categories: FIFOs
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Microchip Technology presents the 5962-8956810QNX, an asynchronous, CMOS FIFO memory device. This component offers a 4kx9 memory organization, providing a total density of 36,864 bits. With a maximum access time of 15ns and a cycle time of 25ns, it is suitable for high-speed data buffering applications. Designed for operation across a wide temperature range from -55°C to +125°C, this FIFO is built to meet stringent environmental requirements. The 5962-8956810QNX features a 28-terminal DFP (Dual Flat Pack) package with a pitch of 1.27mm, conforming to JESD-30 Code R-XDFP-F28. Its reliable performance makes it a component of choice in aerospace, defense, and industrial automation systems requiring robust data management solutions.
Additional Information
Series: 5962-8956810RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 18.2880 |
| Width | 10.1600 |
| Technology | CMOS |
| Access_Time_Max | 15.0000000000000000 |
| Cycle_Time | 25.0000000000000000 |
| JESD_30_Code | R-XDFP-F28 |
| Memory_Density | 36864.0000000000000000 |
| Memory_IC_Type | OTHER FIFO |
| Memory_Organization | 4KX9 |
| Memory_Width | 9 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 28 |
| Number_of_Words | 4096.0000000000000000 |
| Number_of_Words_Code | 4k |
| Operating_Mode | Asynchronous |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Output_Enable | No |
| Package_Body_Material | UNSPECIFIED |
| Package_Code | DFP |
| Package_Shape | Rectangular |
| Package_Style | FlatPack |
| Parallel_Serial | Parallel |
| Screening_Level_Reference_Standard | MIL-PRF-38535 Class Q |
| Seated_Height_Max | 3.3000 |
| Supply_Voltage_Max | 5.50000 |
| Supply_Voltage_Min | 4.50000 |
| Supply_Voltage_Nom | 5 |
| Surface_Mount | Yes |
| Terminal_Form | Flat |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Dual |
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