WEDPN16M72V-133B3I
Synchronous DRAM, 16MX72, 5.5ns, CMOS, PBGA219Manufacturer: Microchip Technology
Categories: DRAMs
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Microchip Technology's WEDPN16M72V-133B3I is a synchronous DRAM component offering a 16M x 72 memory organization. This device features a maximum access time of 5.5ns and operates in a CMOS technology. It supports a four-bank page burst access mode and includes auto/self refresh capabilities, along with LG-MAX and WD-MAX features. The component is housed in a 219-ball PBGA (Plastic Ball Grid Array) package with a 1.27mm terminal pitch and a maximum seated height of 2.64mm. Operating within an industrial temperature range of -40°C to +85°C, it requires a supply voltage between 3.0V and 3.6V. This high-density memory solution is suitable for applications in computing, networking, and industrial automation.
Additional Information
Series: WEDPN16M72RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 21.1000 |
| Width | 21.1000 |
| Technology | CMOS |
| Access_Mode | FOUR BANK PAGE BURST |
| Access_Time_Max | 5.5000000000000000 |
| Additional_Feature | AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED |
| JESD_30_Code | S-PBGA-B219 |
| Memory_Density | 1207959552.0000000000000000 |
| Memory_IC_Type | SYNCHRONOUS DRAM |
| Memory_Organization | 16MX72 |
| Memory_Width | 72 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 219 |
| Number_of_Words | 16777216.0000000000000000 |
| Number_of_Words_Code | 16m |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 2.6400 |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 3.60000 |
| Supply_Voltage_Min | 3.00000 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
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