W3J512M36K-1066B2I
DDR3L DRAM, 512MX36, CMOS, PBGA204Manufacturer: Microchip Technology
Categories: DRAMs
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Microchip Technology W3J512M36K-1066B2I is a 19.3 Gb DDR3L DRAM component organized as 512M x 36 bits. This CMOS memory utilizes a 204-ball Fine-Pitch Ball Grid Array (FBGA) package, identified by R-PBGA-B204, with a terminal pitch of 0.80 mm. Operating in synchronous mode, it supports single bank page burst access and features auto/self-refresh capabilities, along with LG-MAX and WD-MAX modes. The operating temperature range is -40°C to +85°C, with a nominal supply voltage of 1.35V, adjustable between 1.283V and 1.45V. This component is suitable for applications in networking, industrial automation, and high-performance computing.
Additional Information
Series: W3J512M36RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 14.6000 |
| Width | 10.1000 |
| Technology | CMOS |
| Access_Mode | SINGLE BANK PAGE BURST |
| Additional_Feature | AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED |
| JESD_30_Code | R-PBGA-B204 |
| Memory_Density | 19327352832.0000000000000000 |
| Memory_IC_Type | DDR3L DRAM |
| Memory_Organization | 512MX36 |
| Memory_Width | 36 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 204 |
| Number_of_Words | 536870912.0000000000000000 |
| Number_of_Words_Code | 512M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY, FINE PITCH |
| Seated_Height_Max | 3.7500 |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 1.45000 |
| Supply_Voltage_Min | 1.28300 |
| Supply_Voltage_Nom | 1.35 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
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