W3J512M36G-1333B3C
DDR3 DRAM, 512MX36, CMOS, PBGA204Manufacturer: Microchip Technology
Categories: DRAMs
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Microchip Technology's W3J512M36G-1333B3C is a high-density DDR3 DRAM component organized as 512M x 36 bits, offering a total capacity of 18 Gigabit. This CMOS device operates in synchronous mode with a single bank page burst access mechanism, supporting Auto and Self Refresh functionalities along with LG-MAX and WD-MAX features. It is housed in a 204-ball plastic fine-pitch ball grid array (PBGA) package, measuring 10.10mm by 14.60mm with a 0.80mm terminal pitch and a maximum seated height of 4.10mm. Operating within a temperature range of 0°C to 70°C, it requires a supply voltage of 1.5V (±0.15V). This component is suitable for demanding applications in sectors such as computing, networking, and industrial automation.
Additional Information
Series: W3J512M36RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 14.6000 |
| Width | 10.1000 |
| Technology | CMOS |
| Access_Mode | SINGLE BANK PAGE BURST |
| Additional_Feature | AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED |
| JESD_30_Code | R-PBGA-B204 |
| Memory_Density | 19327352832.0000000000000000 |
| Memory_IC_Type | DDR3 DRAM |
| Memory_Organization | 512MX36 |
| Memory_Width | 36 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 204 |
| Number_of_Words | 536870912.0000000000000000 |
| Number_of_Words_Code | 512M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY, FINE PITCH |
| Seated_Height_Max | 4.1000 |
| Self_Refresh | Yes |
| Supply_Voltage_Max | 1.57500 |
| Supply_Voltage_Min | 1.42500 |
| Supply_Voltage_Nom | 1.5 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
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