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FPGAs (Field Programmable Gate Array)
LCMXO2-1200HC-4TG144I


Manufacturer: Lattice Semiconductor Corporation
Categories: FPGAs (Field Programmable Gate Array)
Quality Control: Learn More
| Packaging | Tray |
| Package / Case | 144-LQFP |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 2.375V ~ 3.465V |
| Number of Logic Elements/Cells | 1280 |
| Supplier Device Package | 144-TQFP (20x20) |
| Number of LABs/CLBs | 160 |
| Total RAM Bits | 65536 |
| Number of I/O | 107 |
| Programmable | Not Verified |
Lattice Semiconductor manufactures low-power programmable logic devices and connectivity solutions, with a focus on FPGAs for edge and embedded applications.
Lattice’s core components include:
Lattice specializes in small form factor, low-power FPGAs optimized for edge computing, embedded control, and connectivity applications.
Lattice serves industries that require low-power processing, flexible design, and real-time edge intelligence.
Lattice’s key industries include:
These industries rely on Lattice for power-efficient programmability, rapid design flexibility, and edge AI capabilities.
Lattice is known for its low-power FPGA platforms and edge computing solutions.
Key Lattice product lines include:
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device that engineers can configure after manufacturing to perform custom hardware functions. Unlike CPUs or GPUs, FPGAs process data in parallel, making them ideal for high-speed computing, AI acceleration, telecommunications, aerospace, industrial automation, and embedded systems.
An FPGA works by using programmable logic blocks and configurable interconnects that engineers customize using hardware description languages (HDLs) such as VHDL or Verilog. This architecture allows the FPGA to process multiple operations simultaneously for real-time performance and low latency.
The difference between an FPGA and a CPU is architecture. CPUs execute instructions sequentially, while FPGAs process data in parallel using customizable hardware logic. This makes FPGAs faster for specialized workloads like AI inference, signal processing, and real-time computing.
CPLDs are optimized for simpler control logic and predictable timing, while FPGAs provide higher logic density and advanced parallel processing for complex applications.
ASICs are custom-built for a specific application, delivering maximum performance, power efficiency, and unit cost optimization at high volumes, while FPGAs offer reprogrammability, faster development cycles, and greater design flexibility for evolving or lower-volume applications.
As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.
After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.
Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.
Our operations teams will handle logistics and fulfillment to ensure supply chain continuity, and our support team will provide clear communication throughout the process.
Our net terms for electronic component sourcing are flexible and vary by order. Our account executives will work with you to ensure our terms meet your company’s needs. We also offer scheduled shipments and inventory management solutions to ensure a steady supply of electronic components, maintain cash flow, and maximize warranty periods. We always offer a warranty on all tested parts. See our sales terms and conditions for more information.
We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.