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TC58BVG0S3HBAI6

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TC58BVG0S3HBAI6

IC FLASH 1GBIT PARALLEL 67VFBGA

Manufacturer: Kioxia America, Inc.

Categories: Memory

Quality Control: Learn More

The Kioxia America, Inc. Benand™ series TC58BVG0S3HBAI6 is a 1Gbit, SLC NAND Flash memory component featuring a parallel interface. This non-volatile memory device offers a fast 25 ns access time and a page program/write cycle time of 25 ns. Designed for surface mount applications, it is housed in a compact 67-VFBGA (6.5x8) package. The memory organization is 128M x 8, supporting a supply voltage range of 2.7V to 3.6V. Operating within an ambient temperature range of -40°C to 85°C, this component is suitable for demanding applications in the industrial and consumer electronics sectors.

Additional Information

Series: Benand™RoHS Status: ROHS3 CompliantManufacturer Lead Time: 12 week(s)Product Status: ActivePackaging: Tray
Technical Details:
PackagingTray
Package / Case67-VFBGA
Mounting TypeSurface Mount
Memory Size1Gbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply2.7V ~ 3.6V
TechnologyFLASH - NAND (SLC)
Memory FormatFLASH
Supplier Device Package67-VFBGA (6.5x8)
Write Cycle Time - Word, Page25ns
Memory InterfaceParallel
Access Time25 ns
Memory Organization128M x 8
ProgrammableNot Verified

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Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

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After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.