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IS61LF102418A-7.5B3I-TR

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IS61LF102418A-7.5B3I-TR

IC SRAM 18MBIT PARALLEL 165TFBGA

Manufacturer: ISSI, Integrated Silicon Solution Inc

Categories: Memory

Quality Control: Learn More

ISSI IS61LF102418A-7-5B3I-TR is a high-performance 18-Mbit parallel synchronous Static Random-Access Memory (SRAM) device. Operating at a speed of 7 ns, this component offers a robust solution for demanding memory applications. Its 165-TFBGA package ensures efficient board space utilization and facilitates high-density integration. The 18-megabit capacity is organized as 1M x 18, providing ample storage for data-intensive systems. This SRAM is designed for applications requiring fast and reliable data access, commonly found in networking infrastructure, telecommunications equipment, and high-speed computing systems. Its synchronous operation simplifies interface design and enables precise timing control. The device's low power consumption characteristics further enhance its suitability for power-sensitive designs. This component is delivered in a tray for convenient handling and integration into automated manufacturing processes.

Additional Information

Series: RoHS Status: Manufacturer Lead Time: Product Status: UnknownPackaging: Tray
Technical Details:

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Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.

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