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AGID019R18A2I3V

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AGID019R18A2I3V

IC FPGA AGILEX-I 1805FBGA

Manufacturer: Intel

Categories: System On Chip (SoC)

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Intel Agilex I Series AGID019R18A2I3V is a System on Chip (SoC) device featuring a quad ARM Cortex-A53 MPCore processor with CoreSight, ARM NEON, and floating-point capabilities. This FPGA offers 1.9 million logic elements and operates at a speed of 1.4GHz. The device supports various connectivity interfaces including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Integrated peripherals include DMA and WDT. The AGID019R18A2I3V is housed in an 1805-BBGA Exposed Pad package, with a supplier device package of 1805-BGA (42.5x42.5). This component is suitable for demanding applications in the telecommunications, data center, and industrial automation industries. It operates within an industrial temperature range of -40°C to 100°C (TJ).

Additional Information

Series: Agilex IRoHS Status: unknownManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: Tray
Technical Details:
PackagingTray
Package / Case1805-BBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 1.9M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package1805-BGA (42.5x42.5)
ArchitectureMPU, FPGA
Flash Size-

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