AGID019R18A2I3E
IC FPGA AGILEX-I 1805FBGAManufacturer: Intel
Categories: System On Chip (SoC)
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Intel Agilex I Series AGID019R18A2I3E is a System on Chip (SoC) featuring an FPGA with 1.9 million logic elements, operating at 1.4GHz. This device integrates a Quad ARM® Cortex®-A53 MPCore™ processor with CoreSight™, ARM NEON, and Floating Point capabilities. Connectivity options include EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The component is housed in an 1805-BBGA Exposed Pad package and operates within an industrial temperature range of -40°C to 100°C (TJ). The architecture combines MPU and FPGA functionalities, offering 256KB of RAM and supporting peripherals such as DMA and WDT. This device is suitable for applications in high-performance computing, data centers, and advanced networking.
Additional Information
Series: Agilex IRoHS Status: unknownManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1805-BBGA Exposed Pad |
| Speed | 1.4GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
| Primary Attributes | FPGA - 1.9M Logic Elements |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 1805-BGA (42.5x42.5) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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