AGFB027R24C3I3E
IC FPGA AGILEX-F 2340FBGAManufacturer: Intel
Categories: System On Chip (SoC)
Quality Control: Learn More
Intel Agilex F AGFB027R24C3I3E System on Chip (SoC) FPGA. This device features a Quad ARM Cortex-A53 MPCore processor with CoreSight, ARM NEON, and Floating Point capabilities, operating at a 1.4GHz frequency. The FPGA fabric offers 2.7 million logic elements. Connectivity options include EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals include DMA and WDT. The device is specified for an operating junction temperature range of -40°C to 100°C and is supplied in Tray packaging. This component is utilized in applications such as data center acceleration, communications infrastructure, and industrial automation.
Additional Information
Series: Agilex FRoHS Status: unknownManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | - |
| Speed | 1.4GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
| Primary Attributes | FPGA - 2.7M Logic Elements |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | - |
| Architecture | MPU, FPGA |
| Flash Size | - |
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