AGFB023R25A2I3V
IC FPGA AGILEX-F 2581FBGAManufacturer: Intel
Categories: System On Chip (SoC)
Quality Control: Learn More
Intel Agilex F Series AGFB023R25A2I3V System on Chip (SoC) FPGA. This device features 2.3 million logic elements and operates at a core frequency of 1.4GHz. The architecture integrates a Quad ARM Cortex-A53 MPCore with CoreSight, ARM NEON, and floating-point capabilities. Connectivity options include EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are also integrated. The device offers 256KB of RAM. This component is suitable for applications in aerospace and defense, automotive, communications, data center, and industrial sectors. The AGFB023R25A2I3V is supplied in Tray packaging and operates within an industrial temperature range of -40°C to 100°C (TJ).
Additional Information
Series: Agilex FRoHS Status: unknownManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | - |
| Speed | 1.4GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
| Primary Attributes | FPGA - 2.3M Logic Elements |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | - |
| Architecture | MPU, FPGA |
| Flash Size | - |
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