AGFA019R31C3E3E
IC FPGA AGILEX-F 3184FBGAManufacturer: Intel
Categories: System On Chip (SoC)
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Intel Agilex F Series AGFA019R31C3E3E System On Chip (SoC) device, featuring a 1.9M logic element FPGA fabric clocked at 1.4GHz. This device integrates Quad ARM Cortex-A53 MPCore processors with CoreSight, ARM NEON, and Floating Point capabilities. The AGFA019R31C3E3E is housed in a 3184-BFBGA Exposed Pad package (56x45). Connectivity options include EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DMA and WDT, with 256KB of RAM. This component is suitable for applications in data center acceleration, high-performance computing, and advanced networking. The AGFA019R31C3E3E is supplied in tray packaging and operates within a temperature range of 0°C to 100°C (TJ).
Additional Information
Series: Agilex FRoHS Status: unknownManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 3184-BFBGA Exposed Pad |
| Speed | 1.4GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
| Primary Attributes | FPGA - 1.9M Logic Elements |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 3184-BGA (56x45) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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