RWIXP2400BB
Microprocessor, PBGA1356Manufacturer: Intel
Categories: Microprocessors
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Intel RWIXP2400BB is a high-performance microprocessor featuring a 1356-ball grid array (BGA) package (S-PBGA-B1356). This square, surface-mount component utilizes ball terminals with a 1.000 mm pitch, positioned on the bottom of the package. The package body is constructed from plastic/epoxy, ensuring robust thermal and mechanical performance within its operating temperature range of 0°C to 70°C. The RWIXP2400 series microprocessors are integral to advanced computing solutions across various industries, including telecommunications, networking, and high-end embedded systems. Its extensive pin count and robust packaging make it suitable for demanding applications requiring significant processing power and connectivity.
Additional Information
Series: RWIXP2400RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| JESD_30_Code | S-PBGA-B1356 |
| Number_of_Terminals | 1356 |
| Operating_Temperature_Max | 70.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA1356,37X37,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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