RWIXP2400BA
Microprocessor, PBGA1356Manufacturer: Intel
Categories: Microprocessors
Quality Control: Learn More
Intel RWIXP2400BA, a PBGA1356 microprocessor from the RWIXP2400 series, is engineered for demanding applications. This component features a square, grid array package with 1356 terminals arranged in a ball grid array (BGA) configuration, utilizing a 1.000mm terminal pitch. The package body is constructed from plastic/epoxy, designed for surface mounting with ball-shaped terminals positioned on the bottom. Operating within a temperature range of 0°C to 70°C, this microprocessor is suitable for deployment in industrial automation, networking infrastructure, and high-performance computing environments.
Additional Information
Series: RWIXP2400RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| JESD_30_Code | S-PBGA-B1356 |
| Number_of_Terminals | 1356 |
| Operating_Temperature_Max | 70.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA1356,37X37,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
Request a Quote
Clients Also Buy
RWIXP2400BB
Microprocessor, PBGA1356
RWIXP2400AB
Microprocessor, PBGA1356
RWIXP2400AA
Microprocessor, PBGA1356
