RWIXP2400AB
Microprocessor, PBGA1356Manufacturer: Intel
Categories: Microprocessors
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Intel RWIXP2400AB is a high-performance microprocessor housed in a 1356-ball Plastic Ball Grid Array (PBGA) package. This component, part of the RWIXP2400 series, features a square package shape with a terminal pitch of 1.000 mm, utilizing bottom-mounted ball terminals. Its operating temperature range spans from 0°C to 70°C, with the package body constructed from plastic/epoxy. This microprocessor is suitable for demanding applications within the computing and networking industries, where robust processing capabilities and a high pin count are essential. The BGA1356 package equivalence code indicates a 37x37 mm footprint.
Additional Information
Series: RWIXP2400RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| JESD_30_Code | S-PBGA-B1356 |
| Number_of_Terminals | 1356 |
| Operating_Temperature_Max | 70.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA1356,37X37,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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