RPIXP2400AB
Microprocessor, PBGA1356Manufacturer: Intel
Categories: Microprocessors
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The Intel RPIXP2400AB is a high-performance microprocessor from the RPIXP2400 series, housed in a 1356-ball plastic/epoxy Ball Grid Array (BGA) package with a square footprint. This S-PBGA-B1356 component features bottom-mounted ball terminals with a 1.000mm pitch, designed for surface mounting applications. With an operating temperature range of 0°C to 70°C, the RPIXP2400AB is suitable for demanding environments. Its robust construction and advanced architecture make it a key component in applications across industrial automation, networking infrastructure, and advanced computing systems. The 1356-terminal count offers extensive connectivity for complex processing tasks.
Additional Information
Series: RPIXP2400RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| JESD_30_Code | S-PBGA-B1356 |
| Number_of_Terminals | 1356 |
| Operating_Temperature_Max | 70.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA1356,37X37,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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